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| Configuration | Part No. | Type | Data Rate | Cable Type | Length | Wire Gauge | Temperature | Note |
|---|---|---|---|---|---|---|---|---|
| 1.6T QSFP-DD to 1.6T QSFP-DD Flat to Flat | CLQD16-QD16AC-1 | Copper | 1600G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 1.6T QSFP-DD to 2x800G QSFP-DD Flat to Flat | CLQD16-2xQD8AC-1 | Copper | 1600G / 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 800G QSFP-DD to 800G QSFP-DD Flat to Flat | CLQD8-QD8AC-1-XD | Copper | 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 1.6T OSFP to 1.6T OSFP Flat to Flat (RHS) | CLOP16-OP16ACR-1 | Copper | 1600G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 1.6T OSFP to 2x800G OSFP Flat to Flat (RHS) | CLOP16-2xOP8ACR-1 | Copper | 1600G / 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 800G OSFP to 800G OSFP Flat to Flat (RHS) | CLOP8-OP8AC-1-XDR | Copper | 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 1.6T OSFP to 1.6T OSFP Finned to Finned (IHS) | CLOP16-OP16AC-1-I | Copper | 1600G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 1.6T OSFP to 2x800G OSFP Finned to Finned (IHS) | CLOP16-2xOP8AC-1-I | Copper | 1600G / 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 800G OSFP to 800G OSFP Finned to Finned (IHS) | CLOP8-OP8AC-1-XD-I | Copper | 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
| 800G QSFP224 to 800G QSFP224 Flat to Flat | CLQ224-Q224AC-1-XD | Copper | 800G IB XDR | Cable | 1M~3M | 26 AWG | Com./Ind. | Datasheet |
The C-LIGHT 1.6T ACC Active Copper Cable is designed for next-generation AI data centers, GPU clusters, high-performance computing (HPC), and high-bandwidth storage networks. Supporting 1600G and 800G InfiniBand XDR connectivity, the active copper architecture integrates signal conditioning to extend copper interconnect reach up to 3 meters while maintaining low latency and efficient power usage. The product family includes QSFP-DD, OSFP, and QSFP224 interfaces, with direct-connect and breakout configurations for flexible network deployment. Flat-to-Flat, OSFP RHS, and Finned-to-Finned (IHS) mechanical designs accommodate different chassis layouts and cooling requirements. All listed models use 26 AWG copper cable assemblies and are available with commercial and industrial temperature options.
Supports 1600G and 800G InfiniBand XDR connections for high-bandwidth communication between next-generation switches, accelerators, and computing systems.
Integrated active signal conditioning helps maintain signal integrity over copper links that can exceed the practical reach of conventional passive DAC assemblies.
Available cable lengths from 1 meter to 3 meters support short-reach connections between equipment in high-density data center environments.
Multiple interface options accommodate different host port architectures and equipment integration requirements.
Configurations include 1.6T-to-1.6T, 1.6T-to-2x800G, and 800G-to-800G for direct connection and port breakout applications.
Flat-to-Flat, Flat-to-Flat (RHS), and Finned-to-Finned (IHS) options support different chassis, port layouts, and cooling designs.
Active Copper Cable (ACC)
1600G and 800G InfiniBand XDR, depending on model
QSFP-DD, OSFP, and QSFP224
Active copper cable assembly with integrated signal conditioning
1 meter to 3 meters
26 AWG
1.6T-to-1.6T, 1.6T-to-2x800G, and 800G-to-800G
Flat-to-Flat, Flat-to-Flat (RHS), and Finned-to-Finned (IHS)
Commercial and industrial temperature options
100% product testing
3-year warranty
Compatibility guidance and technical support
This 1.6T QSFP-DD-to-QSFP-DD ACC cable provides a direct connection between two 1600G InfiniBand XDR ports. Its Flat-to-Flat design supports compatible QSFP-DD equipment layouts, with cable lengths from 1 meter to 3 meters.
This 1.6T QSFP-DD-to-2x800G QSFP-DD breakout cable connects one 1600G interface to two 800G interfaces, supporting flexible bandwidth distribution across compatible network platforms.
This 800G QSFP-DD-to-QSFP-DD ACC cable provides a direct copper connection between compatible 800G InfiniBand XDR ports in high-density computing and networking environments.
This 1.6T OSFP-to-OSFP ACC cable uses a Flat-to-Flat (RHS) configuration for direct 1600G InfiniBand XDR connectivity between compatible OSFP interfaces.
This 1.6T OSFP-to-2x800G OSFP breakout cable uses a Flat-to-Flat (RHS) design to connect a 1600G host port to two compatible 800G ports.
This 800G OSFP-to-OSFP ACC cable uses a Flat-to-Flat (RHS) mechanical design for direct 800G InfiniBand XDR connections in compatible systems.
This 1.6T OSFP-to-OSFP ACC cable uses a Finned-to-Finned (IHS) design for compatible 1600G InfiniBand XDR platforms with finned OSFP mechanical interfaces.
This 1.6T OSFP-to-2x800G OSFP breakout cable uses a Finned-to-Finned (IHS) configuration for systems requiring one 1600G connection to branch into two 800G connections.
This 800G OSFP-to-OSFP ACC cable features a Finned-to-Finned (IHS) design for short-reach 800G InfiniBand XDR connectivity in compatible chassis.
This 800G QSFP224-to-QSFP224 ACC cable provides a direct copper connection between compatible 800G InfiniBand XDR ports. The active cable assembly uses 26 AWG copper conductors and supports cable lengths from 1 meter to 3 meters.
The QSFP224 configuration provides an additional 800G interface option for host platforms designed around compatible QSFP224 ports and high-bandwidth copper interconnects.
Active circuitry helps compensate for signal degradation across high-speed electrical channels, supporting reliable transmission over copper cable assemblies.
Compared with conventional passive DAC designs, ACC technology is intended to support longer short-reach copper connections, with the listed family extending up to 3 meters.
The electrical connection avoids optical-electrical conversion within the cable link, making active copper suitable for low-latency connectivity between compatible high-speed ports.
Straight-through configurations connect two compatible 1600G interfaces without requiring a breakout topology.
Breakout assemblies enable a compatible 1600G port to connect with two 800G ports, subject to host port mapping and system support.
Dedicated 800G QSFP-DD, OSFP, and QSFP224 models allow connector form factors to be selected according to the installed network equipment.
Flat-to-Flat designs support compatible QSFP-DD and other listed port layouts where matching flat mechanical interfaces are required.
RHS variants provide a specific OSFP mechanical profile for platforms designed around the corresponding reduced-height interface.
IHS variants use finned OSFP connector housings to match compatible chassis and thermal-management designs.
The product family offers commercial and industrial temperature variants so the cable assembly can be selected according to the intended operating environment.
Provides high-bandwidth copper interconnects between compatible switches, accelerators, and GPU cluster networking equipment.
1600G and 800G InfiniBand XDR configurations support high-throughput, low-latency communication in HPC systems.
Active copper connections provide a short-reach alternative for high-density data center equipment where passive copper reach may be insufficient.
The high-bandwidth cable family supports compatible storage systems and associated data center infrastructure requiring fast inter-device communication.
Cable lengths from 1 meter to 3 meters are suitable for short-reach connections within racks and between nearby equipment, subject to the link design.
The 1.6T-to-2x800G variants support compatible host platforms requiring one high-bandwidth interface to connect with two 800G interfaces.
The C-LIGHT 1.6T ACC Cable family combines active copper signal conditioning, 1600G and 800G InfiniBand XDR support, and flexible QSFP-DD, OSFP, and QSFP224 connectivity. Direct and breakout configurations, 1-meter to 3-meter lengths, 26 AWG copper assemblies, and Flat-to-Flat, RHS, and IHS mechanical options make it possible to match the cable to different port architectures, chassis designs, and AI data center interconnect requirements.
A 1.6T Active Copper Cable uses integrated signal conditioning to support high-speed electrical transmission between compatible network ports over short copper links.
The listed products support 1600G and 800G InfiniBand XDR connectivity, depending on the model and connection configuration.
The product range includes QSFP-DD, OSFP, and QSFP224 interfaces.
The series includes 1.6T-to-2x800G breakout assemblies for connecting one compatible 1600G interface to two compatible 800G interfaces.
All listed models use 26 AWG copper cable assemblies with lengths from 1 meter to 3 meters.
The product family provides Flat-to-Flat (RHS) and Finned-to-Finned (IHS) mechanical configurations to match different compatible OSFP port, chassis, and cooling designs.
Yes. Commercial and industrial temperature options are listed for the product family; the appropriate variant should be selected according to the target equipment and operating environment.
Designed for next-generation AI, HPC, and data center networks, the C-LIGHT 1.6T ACC family provides 1600G and 800G InfiniBand XDR connections, active copper signal conditioning, QSFP-DD/OSFP/QSFP224 options, breakout configurations, and 1-meter to 3-meter, 26 AWG cable assemblies.
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